Chemical Mechanical Polishing Application Literature for Semiconductor Manufacturing

Title Sub-Process(es) of Interest Process
Improvements
Business
Benefits
Products
Covered
Application
Bulletins
Copper Barrier CMP Filtration
of Colloidal Silica Slurries
 
N/A  
  • Efficient removal of oversized particles leading to few microscratch defects on wafer
  • Range of flow rates accomodated
  • Greater surface area leading to longer tool life
  • Longer intervals between change outs
  • Smaller capsule enables installation at or near the tool 
  • Lower total cost of ownership