Chemical Mechanical Polishing Filtration for Semiconductor Manufacturing

Pall partners with suppliers and end users to provide chemical mechanical polishing (CMP) filtration solutions. 

We are continually working to develop more efficient and economic products that address the wide variety of slurries and applications.

To see which Pall products work for your process(es), see the process chart below, which illustrates where filters are located in the process, and then compare against the tables that follow for each of the slurries.

 

Semiconductor overview
Semiconductor - Applications
Semiconductor - Chemical
Semiconductor - CMP
Semiconductor - Gas Filtration and Purification
Semiconductor - Photolithography
Semiconductor - Ultrapure Water
Semiconductor - Wastewater Treatment
Chemical Mechanical Polishing Filtration for Semiconductor Application Literature

Recommended Filter Locations

 

Filtration Solutions for Inter Layer Dialectric (ILD)

ILD slurries are typically comprised of high solids (> 10%) fumed or colloidal silica. In addition, ceria abrasives at lower percent solids are being incorporated in some of today's more advanced dielectric applications.

 

 
Slurry Type 1. Tote to Day Tank 2. Global Loop 3. Point of Use (POU)
Fumed Silica  CMPure CMPD 1.5  CMPure CMPD 10  Starkleen™ A015 (capsule)
CMPure CMPD 1.5 (cartridge)
Colloidal Silica  Profile® II Y005  CMPure CMPD 5 Starkleen Y005 (capsule)
Profile II Y005 (cartridge) 
 Ceria   Profile II Y002  Profile II Y030  Profile II Y002 (capsule or cartridge)
 

 

Filtration Solutions for Bulk Copper

First step (or bulk) copper slurries are typically comprised of low solids (< 5%) fumed alumina or colloidal silica. These slurries may contain proprietary chemistries that can influence filtration performance. The recommendations below are a general guideline. It is advised that you contact your Pall representative to obtain the most suitable filter recommendation for your specific slurry.

 
Slurry Type 1. Tote to Day Tank 2. Global Loop 3. Point of Use (POU)
Fumed Alumina  Profile II Y005  CMPure CMPD 5 Starkleen Y003 (capsule)
Profile II Y003 (cartridge)
 Colloidal Silica  Profile II Y005  CMPure CMPD 5 Starkleen Y003 (capsule)
Profile II Y003 (cartridge) 
 

 

Filtration Solutions for Barrier Copper

Barrier copper slurries are typically comprised of higher solids (usually 5% - 10%) fumed or colloidal silica. These slurries may contain proprietary chemistries that can influence filtration performance. The recommendations below are a general guideline. It is advised that you contact your Pall representative to obtain the most suitable filter recommendation for the specific slurry.

 
Slurry Type 1. Tote to Day Tank 2. Global Loop 3. Point of Use (POU)
Fumed Silica  CMPure CMPure 1.5 CMPure CMPD 10 Starkleen A010 (capsule)
CMPure CMPD 1.5 (cartridge)
 Colloidal Silica  Profile II Y010  CMPure CMPD 5 Starkleen Y003 (capsule)
Profile II Y003 (cartridge)
 

 

Filtration Solutions for Shallow Trench Isolation (STI)

STI slurries are typically comprised of ceria abrasives (5 % - 10%) solids. High solids (> 10%) fumed silica slurries have also been used for this application.  
 
Slurry Type 1. Tote to Day Tank 2. Global Loop 3. Point of Use (POU)
Ceria Profile II Y002 Profile II Y030 Profile II Y002 (capsule or cartridge)
 Fumed Silica  CMPure CMPD 1.5  CMPure CMPD 10 Starkleen A010 (capsule)
CMPure CMPD 1.5 (cartridge)
 

 

Filtration Solutions for Tungsten

Fumed and colloidal silica at low solids (< 5 %) are typically used for tungsten applications. Colloidal alumina is often the abrasive of choice on some mature applications.

 
Slurry Type 1. Tote to Day Tank 2. Global Loop 3. Point of Use (POU)
Colloidal Silica Profile II Y005 CMPure CMPD 5 Starkleen Y005 (capsule)
Profile II Y005 (cartridge)
Fumed Silica Profile II Y005 CMPure CMPD 5 Starkleen A010 (capsule)
Profile II Y005 (cartridge)
 Colloidal Alumina  Profile II Y005  CMPure CMPD 20

Starkleen A050 (capsule)
Profile II Y050 (cartridge)