Pall partners with suppliers and endusers to provide chemical mechanical polishing (CMP) filtration solutions.  Pall is continually working to develop more efficient and economic products that address the wide variety of slurries and applications. Our product recommendations for each application are based upon Pall’s experience with the various slurries used in the CMP processes noted below, as well as customer feedback and in-house testing.

Please view the pdf below for application information and recommendations.

CMP Introduction 

View Products
Semiconductor-CMP Products

View Application Bulletin
Copper Barrier CMP Filtration of Colloidal Silica Slurries