Chemical Application Literature for Semiconductor Manufacturing

Title Sub-Process(es) of Interest Process Improvements Business Benefits Products Covered
Application Bulletins
A Guide to Pall Corporation's Fluoropolymer Filters (PDF) 
  • Semiconductor Fabrication
  • Filtration of aqueous chemicals
  • Prewetting hydrophobic filters
  • Minimize installation difficulties and environmental exposure to prewet fluids
  • Eliminate need to prewet using a low surface tension fluid
  • Reduce total costs of ownership 
Advanced Filtration for Copper Electrochemical Deposition Systems (PDF) N/A
  • Improve the problematic integration of copper process interconnect technology
Dilute HF Aqueous Cleaning Using Asymmetric Polyarylsulfone Membrane Filtration (PDF)
  • Oxidation
  • Deposition
  • Annealing
  • Wet cleaning
  • Reduce particle counts
  • Decreased defects
  • Faster flow
  • Less maintenance
  • Increased bath turnover rate
  • Reduced qualification time
  • Increased throughput
  • Improve performance
  • Reduce cycle time
  • Minimize work required of the pumping system
  • Reduce operating cost
  • Higher process yields
Technical Articles
A Novel Filter Rating Method Using Less than 30 nm Gold Nanoparticle and Protective Ligand (PDF)  N/A  
  •  Reduce particle-membrane attractive interaction 
Cleaner Filters for Cleaner Wafers - March 2006 Semiconductor International (PDF) N/A 
  • Improve contamination levels on wafer surfaces 
N/A  N/A 
Eliminating the Need to Prewet Hydrophobic Filters with Low Surface Tension Fluids
  • Etching
  • Cleaning
  • Photoresist development
  • Reduce operator exposure to alcohols
  • Negate the need for grounding systems due to flammability hazards
  • Reduce the time required to change out all-fluorocarbon filters due to significantly faster TOC rinse-up times with the ability to immediately install the filters in bulk, distribution, and POU applications. 
  • Significant savings in volume of UPW required to achieved background TOC levels.
  • Eliminate the possibility of cross contamination due to inadequate flushing with DI water to remove the prewetting solvent.
  • Eliminate the possibility of experiencing a high clean differential pressure due to incomplete wetting of the hydrophobic filter.
  • Reduce waste disposal costs. 


Cleaner Filters for Cleaner Wafers - March 2006 Semiconductor International (PDF) N/A 
  • Improve contamination levels on wafer surfaces 
N/A  N/A 
New Prewetting Filter Technology - February, 1998 Channel Magazine 


  • Eliminate need to prewet filters with low surface tension fluids
  • Reducing the time to change out filters through faster TOC and resistivity rinse up times
  • Reducing operator exposure to alcohols


Prevention of Microbubbles During Filtration and Particle Counting of High Purity Chemicals in the Semiconductor Industry
  • Buffered oxide etch (BOE)
  • Minimize presence of microbubbles 


Technical Position on Use of PEI Polymer Retaining Ring (PDF)
  • Wet chemical application
  • Retain tensile strength